Nickel Vanadium Sputtering Target

Nickel vanadium Sputtering Targets are produced by vacuum melting technology, they are usually applied for semiconductor field to deposit barrier or adhesion layers, and also applied for display and micro-electronic fields. Our factory have 10 years more production experience of nickel vanadium targets, with up to 4N purity, special annealing treatment, uniform and fine grain size, lower oxygen content, our customers can obtain constant erosion rates as well as high purity and homogeneous thin film coating during PVD process.

Features

Chemical Composition: NiV 93/7wt%, other composition can be customized

Segregation of weight: +/-0.5wt%

Available Purity: 3N5, 4N

Production Technology: melting

Shapes: planar targets, rotary targets

Average Grain Size: < 100um

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